Thermal interface materials

ABSTRACT

A crosslinkable thermal interface material is produced by combining at least one rubber compound, at least one amine resin and at least one thermally conductive filler. This interface material takes on the form of a liquid or “soft gel”. The gel state is brought about through a crosslinking reaction between the at least one rubber compound composition and the at least one amine resin composition. Once the foundation composition that comprises at least one rubber compound, at least one amine resin, and at least one thermally conductive filler has been prepared, the composition must be compared to the needs of the electronic component, vendor, or electronic product to determine if a phase change material is needed to change some of the physical properties of the composition. A method for forming the crosslinkable thermal interface materials disclosed herein comprises a) providing at least one saturated rubber compound, b) providing at least one amine resin, c) crosslinking the at least one saturated rubber compound and the at least one amine resin to form a crosslinked rubber-resin mixture, d) adding at least one thermally conductive filler to the crosslinked rubber-resin mixture, and e) adding a wetting agent to the crosslinked rubber-resin mixture. This method can also further comprise adding at least one phase change material to the crosslinked rubber-resin mixture. The contemplated thermal interface material can be provided as a dispensable liquid paste, a gel, a tape, or a film. Applications of the contemplated thermal interface materials described herein comprise incorporating the materials into a layered material, an electronic component or a finished electronic product.

[0001] This application is a continuation in part and claims the benefitof U.S. Utility application Ser. No. 09/452,483 filed Dec. 1, 1999,which is incorporated herein by reference in its entirety.

FIELD OF THE INVENTION

[0002] The field of the invention is interface materials in electroniccomponent and layered materials applications.

BACKGROUND OF THE INVENTION

[0003] Electronic components are used in ever increasing numbers ofconsumer and commercial electronic products. Examples of some of theseconsumer and commercial products are televisions, personal computers,internet servers, cell phones, pagers, palm-type organizers, portableradios, car stereos, or remote controls. As the demand for theseconsumer and commercial electronics increases, there is also a demandfor those same products to become smaller, more functional, and moreportable for consumers and businesses.

[0004] As a result of the size decrease in these products, thecomponents that comprise the products must also become smaller. Examplesof some of those components that need to be reduced in size or scaleddown are printed circuit or wiring boards, resistors, wiring, keyboards,touch pads, and chip packaging.

[0005] Components, therefore, are being broken down and investigated todetermine if there are better building materials and methods that willallow them to be scaled down to accommodate the demands for smallerelectronic components. In layered components, one goal appears to bedecreasing the number of the layers while at the same time increasingthe functionality and durability of the remaining layers. This task canbe difficult, however, given that several of the layers and componentsof the layers should generally be present in order to operate thedevice.

[0006] Also, as electronic devices become smaller and operate at higherspeeds, energy emitted in the form of heat increases dramatically. Apopular practice in the industry is to use thermal grease, orgrease-like materials, alone or on a carrier in such devices to transferthe excess heat dissipated across physical interfaces. Most common typesof thermal interface materials are thermal greases, phase changematerials, and elastomer tapes. Thermal greases or phase changematerials have lower thermal resistance than elastomer tape because ofthe ability to be spread in very thin layers and provide intimatecontact between adjacent surfaces. Typical thermal impedance valuesrange between 0.6-1.6° C. cm²/w. However, a serious drawback of thermalgrease is that thermal performance deteriorates significantly afterthermal cycling, such as from 65° C. to 150° C., or after power cyclingwhen used in VLSI chips. It has also been found that the performance ofthese materials deteriorates when large deviations from surfaceplanarity causes gaps to form between the mating surfaces in theelectronic devices or when large gaps between mating surfaces arepresent for other reasons, such as manufacturing tolerances, etc. Whenthe heat transferability of these materials breaks down, the performanceof the electronic device in which they are used is adversely affected.

[0007] Thus, there is a continuing need to: a) design and producethermal interface materials and layered materials that meet customerspecifications while minimizing the size of the device and number oflayers; and b) develop reliable methods of producing desired thermalinterface materials and layered materials and components comprisingcontemplated thermal interface and layered materials.

SUMMARY OF THE INVENTION

[0008] A contemplated crosslinkable thermal interface material isproduced by combining at least one rubber compound, at least one amineresin and at least one thermally conductive filler. This contemplatedinterface material takes on the form of a liquid or “soft gel”. The gelstate is brought about through a crosslinking reaction between the atleast one rubber compound composition and the at least one amine resincomposition. More specifically, the amine resin is incorporated into therubber composition to crosslink the primary hydroxyl groups on therubber compounds thus forming the soft gel phase. Therefore, it iscontemplated that at least some of the rubber compounds will comprise atleast one terminal hydroxyl group.

[0009] Amine or amine-based resins are added or incorporated into therubber composition or mixture of rubber compounds primarily tofacilitate a crosslinking reaction between the amine resin and theprimary or terminal hydroxyl groups on at least one of the rubbercompounds. The crosslinking reaction between the amine resin and therubber compounds leads to a “soft gel” phase to the mixture, instead ofa liquid state.

[0010] Once the foundation composition that comprises at least onerubber compound, at least one amine resin, and at least one thermallyconductive filler has been prepared, the composition must be compared tothe needs of the electronic component, vendor, or electronic product todetermine whether a phase change material is needed to change some ofthe physical properties of the composition.

[0011] Phase change materials are useful in thermal interface materialapplications because they store and release heat as they oscillatebetween solid and liquid form. A phase change material gives off heat asit changes to a solid state, and as it returns to a liquid, it absorbsheat. The phase change temperature is the melting temperature at whichthe heat absorption and rejection takes place.

[0012] A method for forming the crosslinkable thermal interfacematerials disclosed herein comprises a) providing at least one saturatedrubber compound, b) providing at least one amine resin, c) crosslinkingthe at least one saturated rubber compound and the at least one amineresin to form a crosslinked rubber-resin mixture, d) adding at least onethermally conductive filler to the crosslinked rubber-resin mixture, ande) adding a wetting agent to the crosslinked rubber-resin mixture. Thismethod can also further comprise adding at least one phase changematerial to the crosslinked rubber-resin mixture.

[0013] The contemplated thermal interface material can be provided as adispensable liquid paste to be applied by dispensing methods and thencured as desired. It can also be provided as a highly compliant, cured,elastomer film or sheet for pre-application on interface surfaces, suchas heat sinks. It can further be provided and produced as a soft gel orliquid that can be applied to surfaces by any suitable dispensingmethod. Even further, the material can be provided as a tape that can beapplied directly to interface surfaces or electronic components.

[0014] Applications of the contemplated thermal interface materialsdescribed herein comprise incorporating the materials into a layeredmaterial, an electronic component or a finished electronic product.

[0015] Various objects, features, aspects and advantages of the presentinvention will become more apparent from the following detaileddescription of preferred embodiments of the invention.

DETAILED DESCRIPTION

[0016] A contemplated crosslinkable thermal interface material isproduced by combining at least one rubber compound, at least one amineresin and at least one thermally conductive filler. This contemplatedinterface material takes on the form of a liquid or “soft gel”. As usedherein, “soft gel” means a colloid in which the disperse phase hascombined with the continuous phase to form a viscous “jelly-like”product. The gel state is brought about through a crosslinking reactionbetween the at least one rubber compound composition and the at leastone amine resin composition. More specifically, the amine resin isincorporated into the rubber composition to crosslink the primaryhydroxyl groups on the rubber compounds, thus forming the soft gelphase. Therefore, it is contemplated that at least some of the rubbercompounds will comprise at least one terminal hydroxyl group. As usedherein, the phrase “primary hydroxyl groups” means that the hydroxylgroups are in the terminal position on the molecule or compound. Therubber compounds may also comprise additional secondary, tertiary, orotherwise internal hydroxyl groups that could also undergo acrosslinking reaction with the amine resin. This additional crosslinkingmay be desirable depending on the final gel state needed for the productor component in which the gel is to be incorporated.

[0017] It is contemplated that the rubber compounds could be“self-crosslinkable” in that they could crosslink intermolecularly withother rubber compounds or intramolecularly with themselves, depending onthe other components of the composition. It is also contemplated thatthe rubber compounds could be crosslinked by the amine resin compoundsand also perform some self-crosslinking activity with themselves orother rubber compounds.

[0018] In preferred embodiments, the rubber compositions or compoundsutilized can be either saturated or unsaturated. Saturated rubbercompounds are preferred in this application because they are lesssensitive to thermal oxidation degradation. Examples of saturatedrubbers that may be used are ethylene-propylene rubbers (EPR, EPDM),polyethylene/butylene, polyethylene-butylene-styrene,polyethylene-propylene-styrene, hydrogenated polyalkyldiene “mono-ols”(such as hydrogenated polybutadiene mono-ol, hydrogenated polypropadienemono-ol, hydrogenated polypentadiene mono-ol), hydrogenatedpolyalkyldiene “diols” (such as hydrogenated polybutadiene diol,hydrogenated polypropadiene diol, hydrogenated polypentadiene diol) andhydrogenated polyisoprene. However, if the compound is unsaturated, itis most preferred that the compound undergo a hydrogenation process torupture or remove at least some of the double bonds. As used herein, thephrase “hydrogenation process” means that an unsaturated organiccompound is reacted with hydrogen by either a direct addition ofhydrogen to some or all of the double bonds, resulting in a saturatedproduct (addition hydrogenation), or by rupturing the double bondentirely, whereby the fragments further react with hydrogen(hydrogenolysis). Examples of unsaturated rubbers and rubber compoundsare polybutadiene, polyisoprene, polystyrene-butadiene and otherunsaturated rubbers, rubber compounds or mixtures/combinations of rubbercompounds.

[0019] As used herein, the term “compliant” encompasses the property ofa material that is yielding and formable at room temperature, as opposedto solid and unyielding at room temperature. As used herein, the term“crosslinkable” refers to those materials or compounds that are not yetcrosslinked.

[0020] More than one rubber of each type may be combined to produce acrosslinkable thermal interface material; however, it is contemplatedthat in the preferred thermal interface material, at least one of therubber compounds or components will be a saturated compound.Olefin-containing or unsaturated interface materials, with appropriatethermal fillers, exhibit a thermal capability of less than 0.5 cm²°C./w. Unlike thermal grease, thermal performance of the material willnot degrade after thermal cycling or flow cycling in IC devices becauseliquid olefins and liquid olefin mixtures (such as those comprisingamine resins) will crosslink to form a soft gel upon heat activation.Moreover, when applied as an interface material, it will not be“squeezed out” as thermal grease does in use and will not displayinterfacial delamination during thermal cycling.

[0021] Amine or amine-based resins are added or incorporated into therubber composition or mixture of rubber compounds primarily tofacilitate a crosslinking reaction between the amine resin and theprimary or terminal hydroxyl groups on at least one of the rubbercompounds. The crosslinking reaction between the amine resin and therubber compounds produces a “soft gel” phase in the mixture, instead ofa liquid state. The degree of crosslinking between the amine resin andthe rubber composition and/or between the rubber compounds themselveswill determine the consistency of the soft gel. For example, if theamine resin and the rubber compounds undergo a minimal amount ofcrosslinking (10% of the sites available for crosslinking are actuallyused in the crosslinking reaction) then the soft gel will be more“liquid-like”. However, if the amine resin and the rubber compoundsundergo a significant amount of crosslinking (40-60% of the sitesavailable for crosslinking are actually used in the crosslinkingreaction and possibly there is a measurable degree of intermolecular orintramolecular crosslinking between the rubber compounds themselves)then the gel would become thicker and more “solid-like”.

[0022] Amine and amino resins are those resins that comprise at leastone amine substituent group on any part of the resin backbone. Amine andamino resins are also synthetic resins derived from the reaction ofurea, thiourea, melamine or allied compounds with aldehydes,particularly formaldehyde. Typical and contemplated amine resins areprimary amine resins, secondary amine resins, tertiary amine resins,glycidyl amine epoxy resins, alkoxybenzyl amine resins, epoxy amineresins, melamine resins, alkylated melamine resins, and melamine-acrylicresins. Melamine resins are particularly useful and preferred in severalcontemplated embodiments described herein because a) they are ring-basedcompounds, whereby the ring contains three carbon and three nitrogenatoms, b) they can combine easily with other compounds and moleculesthrough condensation reactions, c) they can react with other moleculesand compounds to facilitate chain growth and crosslinking, d) they aremore water resistant and heat resistant than urea resins, e) they can beused as water-soluble syrups or as insoluble powders dispersible inwater, and f) they have high melting points (greater than 325° C. andare relatively non-flammable). Alkylated melamine resins, such asbutylated melamine resins, are formed by incorporating alkyl alcoholsduring the resin formation. They are soluble in paint and enamelsolvents and in surface coatings.

[0023] Thermal filler particles to be dispersed in the thermal interfacematerial or mixture should advantageously have a high thermalconductivity. Suitable filler materials include metals, such as silver,copper, aluminum, and alloys thereof, and other compounds, such as boronnitride, aluminum nitride, silver coated copper, silver coated aluminumand carbon fibers. Combinations of boron nitride and silver or boronnitride and silver/copper also provide enhanced thermal conductivity.Boron nitride in amounts of at least 20 wt % and silver in amounts of atleast about 60 wt % are particularly useful. Preferably, fillers with athermal conductivity of greater than about 20 and most preferably atleast about 40 w/m° C. will be used. Optimally, it is desired to have afiller of not less than about 80 w/m° C. thermal conductivity.

[0024] As used herein, the term “metal” means those elements that are inthe d-block and f-block of the Periodic Chart of the Elements, alongwith those elements that have metal-like properties, such as silicon andgermanium. As used herein, the phrase “d-block” means those elementsthat have electrons filling the 3d, 4d, 5d, and 6d orbitals surroundingthe nucleus of the element. As used herein, the phrase “f-block” meansthose elements that have electrons filling the 4f and 5f orbitalssurrounding the nucleus of the element, including the lanthanides andthe actinides. Preferred metals include indium, silver, copper,aluminum, tin, bismuth, gallium and alloys thereof, silver coatedcopper, and silver coated aluminum. The term “metal” also includesalloys, metal/metal composites, metal ceramic composites, metal polymercomposites, as well as other metal composites. As used herein, the term“compound” means a substance with constant composition that can bebroken down into elements by chemical processes.

[0025] Of special efficacy is a filler comprising a particular form ofcarbon fiber referred to as “vapor grown carbon fiber” (VGCF) such as isavailable from Applied Sciences, Inc., Cedarville, Ohio. VGCF, or“carbon micro fibers”, are highly graphized types by heat treatment(thermal conductivity=1900 w/m° C.). Addition of about 0.5 wt. % carbonmicro fibers provides significantly increased thermal conductivity. Suchfibers are available in varying lengths and diameters; namely, 1millimeter (mm) to tens of centimeters (cm) length and from under 0.1 toover 100 μm in diameter. One useful form of VGCF has a diameter of notgreater than about 1 μm and a length of about 50 to 100 μm, and possessa thermal conductivity of about two or three times greater than withother common carbon fibers having diameters greater than 5 μm.

[0026] It is difficult to incorporate large amounts of VGCF in polymersystems and interface systems, such as the hydrogenated rubber and resincombination already discussed. When carbon microfibers, e.g. (about 1μm, or less) are added to the polymer they do not mix well, primarilybecause a large amount of fiber must be added to the polymer to obtainany significant beneficial improvement in thermal conductivity. However,we have found that relatively large amounts of carbon microfibers can beadded to polymer systems that have relatively large amounts of otherconventional fillers. A greater amount of carbon microfibers can beadded to the polymer when added with other fibers, which can be addedalone to the polymer, thus providing a greater benefit with respect toimproving thermal conductivity of the thermal interface material.Desirably, the ratio of carbon microfibers to polymer is in the range of0.05 to 0.50 by weight.

[0027] Once the foundation composition that comprises at least onerubber compound, at least one amine resin, and at least one thermallyconductive filler has been prepared, the composition must be compared tothe needs of the electronic component, vendor, or electronic product todetermine if an additional phase change material is needed to changesome of the physical properties of the composition. Specifically, if theneeds of the component or product require that the composition orinterface material be in a “soft gel” form or a somewhat liquid form,then an additional phase change material may not need to be added.However, if the component, layered material or product requires that thecomposition or material be more like a solid, then at least one phasechange material should be added.

[0028] Phase-change materials that are contemplated herein comprisewaxes, polymer waxes or mixtures thereof, such as paraffin wax. Paraffinwaxes are a mixture of solid hydrocarbons having the general formulaC_(n)H_(2n+2) and having melting points in the range of about 20° C. to100° C. Polymer waxes are typically polyethylene waxes, polypropylenewaxes, and have a range of melting points from about 40° C. to 160° C.

[0029] Phase change materials are useful in thermal interface materialapplications because they store and release heat as they oscillatebetween solid and liquid form. As a phase change material changes to asolid state, it gives off heat. As it returns to a liquid, it absorbsheat. The phase change temperature is the melting temperature at whichthe heat absorption and rejection takes place.

[0030] Paraffin-based phase change materials, however, have severaldrawbacks. On their own, they can be very fragile and difficult tohandle. They also tend to squeeze out of a gap from the device in whichthey are applied during thermal cycling, very much like grease. Therubber-resin modified paraffin polymer wax system in accordance with theinvention avoids these problems and provides significantly improved easeof handling, is capable of being produced in flexible tape or solidlayer form, and does not pump out or exude under pressure. Although therubber-resin-wax mixtures may have the same or nearly the sametemperature, their melt viscosity is much higher and they do not migrateeasily. Moreover, the rubber-wax-resin mixture can be designed to beself-crosslinking which ensures elimination of the pump-out problem incertain applications. Examples of contemplated phase change materialsare malenized paraffin wax, polyethylene-maleic anhydride wax, andpolypropylene-maleic anhydride wax. The rubber-resin-wax mixtures willfunctionally form at a temperature between about 50 to 150° C. to form acrosslinked rubber-resin network.

[0031] It is also advantageous to incorporate additional fillers,substances or particles, such as filler particles, wetting agents orantioxidants. Substantially spherical filler particles can be added tothe interface mixture to maximize packing density. Additionally,substantially spherical shapes or the like will provide some control ofthe thickness during compaction. Typical particle sizes useful forfillers in the rubber material may be in the range of about 1-20 μm witha maximum of about 100 μm.

[0032] Dispersion of filler particles can be facilitated by addition offunctional organometallic coupling agents or “wetting” agents, such asorganosilane, organotitanate, organozirconium, etc. Organotitanate actsa wetting enhancer to reduce paste viscosity and to increase fillerloading. An organotitanate that can be used is isopropyl triisostearyltitanate. The general structure of organotitanate is RO—Ti(OXRY) whereRO is a hydrolyzable group, and X and Y are binder functional groups.

[0033] Antioxidants may also be added to inhibit oxidation and thermaldegradation of the cured rubber gel or solid composition. Typical usefulantioxidants include Irganox 1076, a phenol type or Irganox 565, anamine type, (at 0.01% to about 1 wt. %), available from Ciba Giegy ofHawthorne, N.Y. Typical cure accelerators include tertiary amines suchas didecylanethylamine, (at 50 ppm—0.5 wt. %).

[0034] At least one catalyst may also be added to the thermal interfacematerial or composition in order to promote a crosslinking or chainreaction between the at least one rubber compound, the at least oneamine resin, the at least one phase change material, or all three. Asused herein, the term “catalyst” means that substance or condition thatnotably affects the rate of a chemical reaction without itself beingconsumed or undergoing a chemical change. Catalysts may be inorganic,organic, or a combination of organic groups and metal halides. Althoughthey are not substances, light and heat can also act as catalysts. Incontemplated embodiments, the catalyst is an acid. In preferredembodiments, the catalyst is an organic acid, such as carboxylic,acetic, formic, benzoic, salicylic, dicarboxylic, oxalic, phthalic,sebacic, adipic, oleic, palmitic, stearic, phenylstearic, amino acidsand sulfonic acid.

[0035] A method for forming the crosslinkable thermal interfacematerials disclosed herein comprises a) providing at least one saturatedrubber compound, b) providing at least one amine resin, c) crosslinkingthe at least one saturated rubber compound and the at least one amineresin to form a crosslinked rubber-resin mixture, d) adding at least onethermally conductive filler to the crosslinked rubber-resin mixture, ande) adding a wetting agent to the crosslinked rubber-resin mixture. Thismethod can also further comprise adding at least one phase changematerial to the crosslinked rubber-resin mixture. As discussed herein,liquid and solid thermal interface mixtures, materials and compositionscan be formed using the contemplated method, along with tapes,electronic components, layered materials and electronic products.

[0036] The contemplated thermal interface material can be provided as adispensable liquid paste to be applied by dispensing methods and thencured as desired. It can also be provided as a highly compliant, cured,elastomer film or sheet for pre-application on interface surfaces, suchas heat sinks. It can further be provided and produced as a soft gel orliquid that can be applied to surfaces by any suitable dispensingmethod. Even further, the material can be provided as a tape that can beapplied directly to interface surfaces or electronic components.

[0037] Applications of the contemplated thermal interface materialsdescribed herein comprise incorporating the materials into a layeredmaterial, an electronic component or a finished electronic product.Electronic components, as contemplated herein, are generally thought tocomprise any layered component that can be utilized in anelectronic-based product. Contemplated electronic components comprisecircuit boards, chip packaging, separator sheets, dielectric componentsof circuit boards, printed-wiring boards, and other components ofcircuit boards, such as capacitors, inductors, and resistors.

[0038] Electronic-based products can be “finished” in the sense thatthey are ready to be used in industry or by other consumers. Examples offinished consumer products are a television, a computer, a cell phone, apager, a palm-type organizer, a portable radio, a car stereo, and aremote control. Also contemplated are “intermediate” products such ascircuit boards, chip packaging, and keyboards that are potentiallyutilized in finished products.

[0039] Electronic products may also comprise a prototype component, atany stage of development from conceptual model to finalscale-up/mock-up. A prototype may or may not contain all of the actualcomponents intended in a finished product, and a prototype may have somecomponents that are constructed out of composite material in order tonegate their initial effects on other components while being initiallytested.

[0040] To illustrate the invention, a number of examples were preparedby mixing the components described in Examples A through F. As indicatedin the tables, the properties of the compositions including viscosity,product form, thermal impedance, modulus of elasticity, and thermalconductivity are also reported.

[0041] The examples shown include one or more of the optional additions,e.g., antioxidant, wetability enhancer, curing accelerators, viscosityreducing agents and crosslinking aids. The amounts of such additions mayvary but, generally, they may be usefully present in the followingapproximate amounts (in wt. %): filler up to 95% of total (filler plusrubbers); wetability enhancer 0.1 to 1% (of total); antioxidant 0.01 to1% (of total); curing accelerator 50 ppm—0.5% (of total); viscosityreducing agents 0.2-15%; and crosslinking aids 0.1-2%. It should benoted the addition at least about 0.5% carbon fiber significantlyincreases thermal conductivity. Composition (by wt %) A B C D E FHydrogenated polybutylene mono-ol 7.5 6.3 10 11.33 5 18 Hydrogenatedpolybutadiene diol none none 2 none none none Paraffin Wax 3.1 2.2 nonenone none none Butylated melamine resin 1.7 0.4 1.33 2 1 4Organotitanate 1.5 1.0 6.67 6.67 4 8 Sulfonic Acid Catalyst 0.1 nonenone none none none Phenolic Antioxidant 0.1 0.1 none none none noneAluminum powder 86 90 80 80 none none Silver Powder none none none none90 none Boron Nitride none none none none none 70 Product Form Tape TapeLiquid Liquid Liquid Liquid Thermal Impedance (oC cm²/w) 0.25 0.18 0.250.25 0.3 0.35 Thermal conductivity (w.m/oC) 3.0 5.0 2.8 2.8 2.3 2.0Modulus of Elasticity, Pa 300000 270000 500000 300000 280000 270000Viscosity, Pa.s N/A N/A 200 160 150 220

[0042] Thus, specific embodiments and applications of thermal interfacematerials have been disclosed. It should be apparent, however, to thoseskilled in the art that many more modifications besides those alreadydescribed are possible without departing from the inventive conceptsherein. The inventive subject matter, therefore, is not to be restrictedexcept in the spirit of the appended claims. Moreover, in interpretingboth the specification and the claims, all terms should be interpretedin the broadest possible manner consistent with the context. Inparticular, the terms “comprises” and “comprising” should be interpretedas referring to elements, components, or steps in a non-exclusivemanner, indicating that the referenced elements, components, or stepsmay be present, or utilized, or combined with other elements,components, or steps that are not expressly referenced.

What is claimed is:
 1. A crosslinkable thermal interface materialcomprising at least one rubber compound, at least one amine resin and atleast one thermally conductive filler.
 2. The thermal interface materialof claim 1, further comprising at least one phase change material. 3.The thermal interface material of claim 1, wherein the at least onerubber compound comprises at least one terminal hydroxy group.
 4. Thethermal interface material of claim 3, wherein the at least one rubbercompound comprises at least one saturated compound.
 5. The thermalinterface material of claim 4, wherein the at least one rubber compoundcomprises hydrogenated polyalkyldiene mono-ol, hydrogenatedpolyalkyldiene diol, or a combination or mixture thereof.
 6. The thermalinterface material of claim 5, wherein the hydrogenated polyalkylcienemono-ol comprises hydrogenated polybutadiene mono-ol.
 7. The thermalinterface material of claim 5, wherein the hydrogenated polyalkyldienediol comprises hydrogenated polybutadiene diol.
 8. The thermal interfacematerial of claim 1, wherein the at least one amine resin comprises amelamine resin.
 9. The thermal interface material of claim 8, whereinthe melamine resin comprises an alkylated melamine resin.
 10. Thethermal interface material of claim 9, wherein the alkylated melamineresin comprises butylated melamine resin.
 11. The thermal interfacematerial of claim 1, wherein the at least one thermally conductivefiller comprises a metal powder, a boron nitride compound or acombination or mixture thereof.
 12. The thermal interface material ofclaim 11, wherein the metal powder comprises aluminum powder, silverpowder, copper powder or a combination or mixture thereof.
 13. Thethermal interface material of claim 2, wherein the at least one phasechange material comprises a wax.
 14. The thermal interface material ofclaim 13, wherein the wax comprises a paraffin wax.
 15. The thermalinterface material of claim 1, further comprising at least one catalyticmaterial.
 16. The thermal interface material of claim 2, furthercomprising at least one catalytic material.
 17. The thermal interfacematerial of one of claim 15 or 16, wherein the at least one catalyticmaterial comprise sulfonic acid catalyst.
 18. The thermal interfacematerial of one of claims 1 or 2, further comprising at least onewetting agent.
 19. The thermal interface material of claim 18, whereinthe wetting agent comprises organotitanate.
 20. A layered componentcomprising the thermal interface material of claim
 1. 21. An electroniccomponent comprising the thermal interface material of claim
 1. 22. Alayered component comprising the thermal interface material of claim 2.23. An electronic component comprising the thermal interface material ofclaim
 2. 24. A liquid composition comprising the thermal interfacematerial of claim
 1. 25. A solid composition comprising the thermalinterface material of claim
 2. 26. A tape comprising the thermalinterface material of claim
 2. 25. A method of forming a crosslinkablethermal interface material, comprising: providing at least one saturatedrubber compound; providing at least one amine resin; crosslinking the atleast one saturated rubber compound and the at least one amine resin toform a crosslinked rubber-resin mixture; adding at least one thermallyconductive filler to the crosslinked rubber-resin mixture; and adding awetting agent to the crosslinked rubber-resin mixture.
 26. The method ofclaim 25, further comprising adding at least one phase change materialto the crosslinked rubber-resin mixture.
 27. A liquid thermal interfacecomposition formed by the method of claim
 25. 28. A solid thermalinterface composition formed by the method of claim
 26. 29. A tapecomprising the thermal interface composition of claim
 28. 30. Anelectronic component comprising the thermal interface material of claim27.
 31. An electronic component comprising the thermal interfacematerial of claim 28.